Plastic Encapsulated Microelectronics (PEMs) components are used in increasing numbers in military applications. Influencing factors are improving reliability, greater availability and federal initiatives for use. This discussion will focus on efforts to introduce plastic encapsulated microcircuits to a highly complex, highly integrated military product. The emphasis of this paper will be on Reliability Testing of these Components. Reliability testing of PEM's for military applications has been somewhat limited in 'high-end' devices and packages. This discussion will focus on testing of a wide range of die sizes including large die (>=0.5' per side), and a wide range of packages, including large packages (up to 2'x2' per side) for both custom and off-the-shelf commercial packages.


    Access

    Access via TIB

    Check availability in my library

    Order at Subito €


    Export, share and cite



    Title :

    ASIC/MCM and microcircuit testing using commercial practices


    Additional title:

    ASIC/MCM- und Mikroschaltungsprüfung mit kommerziellen Methoden


    Contributors:
    Miller, M. (author) / Myers, M. (author)


    Publication date :

    1996


    Size :

    13 Seiten, 8 Bilder, 1 Tabelle



    Type of media :

    Conference paper


    Type of material :

    Print


    Language :

    English




    ASIC/MCM and Microcircuit Testing Using Commercial Practices

    Miller, M. / Myers, M. / IEEE; Dayton Section et al. | British Library Conference Proceedings | 1996



    Microcircuit-cleaning machine

    Robinson, W. W. / Williamson, J. C. | NTRS | 1978


    Microcircuit photography technique

    Dahms, D. / Slaughter, B. | NTRS | 1977


    Microcircuit masking techniques

    Gaudiano, S. | NTRS | 1967