The Starship turboprop commuter airplane incorporates advanced aerodynamic design and is equipped with the latest in avionics. High-density packaging is achieved by combining increased device integration, surface mounting, and efficient mechanical design.


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    Title :

    Packaging avionics with SMT and gate arrays


    Additional title:

    Packungstechnologie in der Avionik mit Oberflaechenmontagetechnologie und Gate Arrays


    Contributors:

    Published in:

    Publication date :

    1988


    Size :

    4 Seiten


    Type of media :

    Article (Journal)


    Type of material :

    Print


    Language :

    English




    Packaging requirements (avionics)

    Hunt, K.J.R. | Tema Archive | 1990



    Modular avionics packaging standardization

    AUSTIN, M. / MCNICHOLS, J. | AIAA | 1984


    Avionics require high density packaging

    Markstein, H.W. | Tema Archive | 1993