Reliability of ball grid arrays (BGAs) was evaluated with special emphasis on space applications. This work was performed as part of a consortium led by the Jet Propulsion Laboratory (JPL) to help build the infrastructure necessary for implementing this technology. Nearly 200 test vehicles, each with four package types, were assembled and tested using an experiment design. The most critical variables incorporated in this experiment were package type, board material, surface finish, solder volume, and environmental condition. The packages used for this experiment were commercially available packages with over 250 I/Os including both plastic and ceramic BGA packages. The test vehicles were subjected to thermal and dynamic environments representative of aerospace applications. Two different thermal cycling conditions were used, the JPL cycle ranged from -30 degrees C to 100 degrees C and the Boeing cycle ranged from -55 degrees C to 125 degrees C. The test vehicles were monitored continuously to detect electrical failure and their failure mechanisms were characterized. They were removed periodically for optical inspection, scanning electron microscopy (SEM) evaluation, and cross-sectioning for crack propagation mapping. Data collected from both facilities were analyzed and fitted to distributions using the Weibull distribution and Coffin-Manson relationships for failure projection. This paper will describe experimental results as well as those analyses.
Ball grid array reliability assessment for aerospace applications
Microelectronics Reliability ; 39 , 1 ; 107-112
1999
6 Seiten, 2 Quellen
Article (Journal)
English
Rissprüfung , Umweltprüfung , Fehleranalyse , Inspektion , Halbleitergehäuse , integrierte Schaltung , Zuverlässigkeit , Kunststoffgehäuse , Rasterelektronenmikroskopie , Anwendung in der Luft- und Raumfahrt , Oberflächenveredlung , Weibull-Verteilung , Raumfahrt , Ball-Grid-Array , optische Inspektion
Assembly Reliability of Ball Grid Array and Chip Scale Packages for High Reliability Applications
British Library Conference Proceedings | 1998
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