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    Title :

    Overlay Multichip Modale Packaging for High Performance MEMS Instruments



    Conference:

    44th, International instrumentation symposium ; 1998 ; Reno; NV



    Publication date :

    1998-01-01


    Size :

    10 pages


    Remarks:

    Also known as the 44th IIS




    Type of media :

    Conference paper


    Type of material :

    Print


    Language :

    English




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