Thermal Design of High Density PCB Assemblies for Space Applications
5th, Vol 1; Power systems, power electronics ; 1998 ; Tarragona; Spain
1998-01-01
8 pages
Conference paper
English
ESA , ESPC , space power
© Metadata Copyright the British Library Board and other contributors. All rights reserved.
Thermal Design of High Density PCB Assemblies for Space Applications
British Library Online Contents | 1998
|Flexible Electronic Assemblies for Space Applications
Online Contents | 2010
|Flexible electronic assemblies for space applications
IEEE | 2010
|High Density. Complex Shaped P/M Assemblies Via MIM for Chassis Applications
British Library Conference Proceedings | 2004
|High Density, Complex Shaped P/M Assemblies Via MIM for Chassis Applications
SAE Technical Papers | 2004
|