Access

    Access via TIB

    Check availability in my library

    Order at Subito €


    Export, share and cite



    Title :

    Emerging Substrate Technologies for Harsh-Environment Automotive Electronics Applications



    Conference:

    World congress, Society of Automotive Engineers; SAE 2002 world congress ; 2002 ; Detroit, MI



    Publication date :

    2002-01-01


    Size :

    ALL


    Remarks:

    Separate papers nos. 2002-01-0068 to 2002-01-1325 with gaps held only



    Type of media :

    Conference paper


    Type of material :

    Print


    Language :

    English




    Emerging Substrate Technologies for Harsh-Environment Automotive Electronics Applications

    Berlin, Carl W. / Sarma, D.H.R. / Fairchild, M. Ray et al. | SAE Technical Papers | 2002


    LTCC technologies for harsh-environment automotive applications utilizing soldered interconnections

    Fairchild, Ray M. / Badgett, Jerry L. / Berlin, Carl W. et al. | Tema Archive | 2004


    Automotive electronics: designing custom ICs for a harsh environment

    Motz, P.R. / Vincent, W.A. | Tema Archive | 1983


    Automotive electronics: designing custom ICs for a harsh environment

    Motz, P.R. / Vincent, W.A. | Tema Archive | 1984


    Sensors and smart electronics in harsh environment applications

    Fahrner, W. R. / Job, R. / Werner, M. | British Library Online Contents | 2001