This paper summarizes the results from an extensive study designed to evaluate LTCC (Low Temperature Co-fired Ceramic) technology for automotive ECM (Engine Control Module) applications and to demonstrate the design advantages that it offers. Test and demonstration parts were prepared from the DuPont 951 green tape system using various tape thicknesses, compatible conductor materials and surface resistors. Conventional performance tests such as solderability, aged adhesion, dielectric voltage breakdown and crossover shorting were carried out, as well as solder-joint based thermal-cycling tests of components including, full array and perimeter bump flip chips. In situations where individual materials demonstrated unacceptable performance, improvements were made or new materials developed. Packaging advantages of LTCC including flip chip on via, backside resistors and constrained sintering (zero shrinkage in the x- and y-directions to improve positional tolerance) are discussed. In addition, material and design solutions to thermal issues that enable single board LTCC designs for ECU's (Electronic Control Unit) are presented. The results of a concurrent project in which a functional engine control product emulator was built and successfully tested are referenced and discussed in the context of the results from this work.


    Access

    Access via TIB

    Check availability in my library


    Export, share and cite



    Title :

    LTCC technologies for harsh-environment automotive applications utilizing soldered interconnections




    Publication date :

    2004


    Size :

    9 Seiten, 10 Bilder, 7 Tabellen, 5 Quellen


    Type of media :

    Conference paper


    Type of material :

    Print


    Language :

    English




    Emerging Substrate Technologies for Harsh-Environment Automotive Electronics Applications

    Berlin, Carl W. / Sarma, D.H.R. / Fairchild, M. Ray et al. | SAE Technical Papers | 2002


    Emerging Substrate Technologies for Harsh-Environment Automotive Electronics Applications

    Fairchild, M. R. / Snyder, R. B. / Berlin, C. W. et al. | British Library Conference Proceedings | 2002


    Soldered flip chip IC's in automotive applications

    Thor, V. / Appel, K. / Nover, M. et al. | Tema Archive | 1998


    Automotive electronics: designing custom ICs for a harsh environment

    Motz, P.R. / Vincent, W.A. | Tema Archive | 1983


    High reliability automotive interconnections

    Anderson,K. / Morgan,D. / AB Controls and Connectors,US | Automotive engineering | 1987