Over 10 Gbps/ch Compact Active Interposer Module for High-Speed and High-Density Chip Level Optical Interconnects
Annual meeting; 16th, IEEE Lasers & Electro-optics Society; LEOS 2003 ; 2003 ; Tucson, AZ
2003-01-01
2 pages
IEEE cat. no. 03CH37460
Conference paper
English
lasers , electro-optics , IEEE , LEOS
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