Over 10 Gbps/ch Compact Active Interposer Module for High-Speed and High-Density Chip Level Optical Interconnects
Annual meeting; 16th, IEEE Lasers & Electro-optics Society; LEOS 2003 ; 2003 ; Tucson, AZ
01.01.2003
2 pages
IEEE cat. no. 03CH37460
Aufsatz (Konferenz)
Englisch
electro-optics , LEOS , IEEE , lasers
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