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    Title :

    WB1.4 Performance of an Ultra-Low Loss, Ultra Compact, Free-Space Packaging Platform for CWDM Applications


    Conference:

    Optical interconnects & VLSI photonics ; 2004 ; San Diego, Calif



    Publication date :

    2004-01-01


    Size :

    2 pages


    Remarks:

    IEEE cat. no. 04TH8728. Held as part of the 2004 IEEE/LEOS Summer topical meeting




    Type of media :

    Conference paper


    Type of material :

    Print


    Language :

    English





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