WB1.4 Performance of an Ultra-Low Loss, Ultra Compact, Free-Space Packaging Platform for CWDM Applications
Optical interconnects & VLSI photonics ; 2004 ; San Diego, Calif
01.01.2004
2 pages
IEEE cat. no. 04TH8728. Held as part of the 2004 IEEE/LEOS Summer topical meeting
Aufsatz (Konferenz)
Englisch
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