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    Title :

    High aspect ratio tapered hollow metallic microneedle arrays with microfluidic interconnector


    Contributors:
    Kim, K. (author) / Lee, J. B. (author)

    Published in:

    MICROSYSTEM TECHNOLOGIES ; 13 , 3-4 ; 231-235


    Publication date :

    2007-01-01


    Size :

    5 pages



    Type of media :

    Article (Journal)


    Type of material :

    Print


    Language :

    English


    Classification :

    DDC:    629.83



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