Conductivity of high-temperature annealed silicon direct wafer bonds
MICROSYSTEM TECHNOLOGIES ; 21 , 5 ; 979-985
2015-01-01
7 pages
Article (Journal)
English
DDC: | 629.83 |
© Metadata Copyright the British Library Board and other contributors. All rights reserved.
British Library Conference Proceedings | 1998
|Metal-silicon carbide bonds for elevated temperature application
Automotive engineering | 1986
|Silicon wafer transport device and silicon wafer transport vehicle
European Patent Office | 2024
|