The invention relates to a blister with reduced noise and vibration. A cover for an integrated power electronics (IPE), the cover comprising: a first sheet; a second sheet bonded to the first sheet through at least one bonding point in a peripheral region; a cavity defined between the bonded first sheet and second sheet wherein the perimeter region seals the cavity; and a filler material disposed within the cavity.

    本发明涉及减少噪声和振动的泡罩。一种用于集成电力电子设备(IPE)的罩,所述罩包括:第一片材;第二片材,其通过周界区域中的至少一个接合点结合到所述第一片材;限定在结合的第一片材和第二片材之间的腔,其中,所述周界区域密封所述腔;以及设置在所述腔内的填充材料。


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    Title :

    Bubble cap for reducing noise and vibration


    Additional title:

    减少噪声和振动的泡罩


    Contributors:
    SADEV ANIL K (author) / HE SONG (author) / MORALES ARIANNA T (author)

    Publication date :

    2023-04-07


    Type of media :

    Patent


    Type of material :

    Electronic Resource


    Language :

    Chinese


    Classification :

    IPC:    F16F SPRINGS , Federn / B60R Fahrzeuge, Fahrzeugausstattung oder Fahrzeugteile, soweit nicht anderweitig vorgesehen , VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR / G10K Tonerzeugungsvorrichtungen , SOUND-PRODUCING DEVICES



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