The invention relates to a blister with reduced noise and vibration. A cover for an integrated power electronics (IPE), the cover comprising: a first sheet; a second sheet bonded to the first sheet through at least one bonding point in a peripheral region; a cavity defined between the bonded first sheet and second sheet wherein the perimeter region seals the cavity; and a filler material disposed within the cavity.
本发明涉及减少噪声和振动的泡罩。一种用于集成电力电子设备(IPE)的罩,所述罩包括:第一片材;第二片材,其通过周界区域中的至少一个接合点结合到所述第一片材;限定在结合的第一片材和第二片材之间的腔,其中,所述周界区域密封所述腔;以及设置在所述腔内的填充材料。
Bubble cap for reducing noise and vibration
减少噪声和振动的泡罩
07.04.2023
Patent
Elektronische Ressource
Chinesisch
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