A power module which comprises a semiconductor chip, at least one cooling plate with at least one cooling channel thermally coupled to the semiconductor chip and being configured so that a coolant is guidable through the at least one cooling channel, and an encapsulant encapsulating at least part of the semiconductor chip and part of the at least one cooling channel, wherein at least part of a main surface of the cooling plate forms part of an external surface of the power module.
Package with partially encapsulated cooling channel for cooling an encapsulated chip
2019-10-29
Patent
Electronic Resource
English
Package with partially encapsulated cooling channel for cooling an encapsulated chip
European Patent Office | 2018
|Package with vertically spaced partially encapsulated contact structures
European Patent Office | 2018
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