We propose a novel modular integrated structure to improve the fabrication yield and reliability of planar lightwave circuit (PLC) hybrid-integrated modules. As a key component, we have developed a chip-scale packaging technique for opto-electronic (OE-) devices, and successfully fabricated a 1.3/1.49/1.55-/spl mu/m optical WDM transceiver module.
PLC-based WDM transceiver with modular structure using chip-scale-packaged OE-devices
2005-01-01
653166 byte
Conference paper
Electronic Resource
English
PLC-based WDM Transceiver with Modular Structure using Chip-Scale-Packaged OE-Devices
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