We propose a novel modular integrated structure to improve the fabrication yield and reliability of planar lightwave circuit (PLC) hybrid-integrated modules. As a key component, we have developed a chip-scale packaging technique for opto-electronic (OE-) devices, and successfully fabricated a 1.3/1.49/1.55-/spl mu/m optical WDM transceiver module.


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    Titel :

    PLC-based WDM transceiver with modular structure using chip-scale-packaged OE-devices


    Beteiligte:
    Nakanishi, Y. (Autor:in) / Hirota, H. (Autor:in) / Watanabe, K. (Autor:in) / Hashizume, Y. (Autor:in) / Ogawa, I. (Autor:in) / Ishii, M. (Autor:in) / Kohtoku, M. (Autor:in) / Yanagisawa, M. (Autor:in) / Endo, J. (Autor:in) / Kurosaki, T. (Autor:in)


    Erscheinungsdatum :

    01.01.2005


    Format / Umfang :

    653166 byte




    Medientyp :

    Aufsatz (Konferenz)


    Format :

    Elektronische Ressource


    Sprache :

    Englisch



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