We adapt a model proposed by Yariv to analyze the two recording procedures via the kinetics of the recording, fixing, and developing processes under either short circuit or preexposed open-circuit boundary condition. From the analysis, we deduce the optimal condition (in terms of the fixing temperature and the compensation time) for each procedure. The results provide useful guides to design thermal fixing procedures for reaching the maximum fixing efficiency.


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    Title :

    Thermal fixing of volume holograms in Fe:LiNbO/sub 3/ crystals


    Contributors:


    Publication date :

    1999-01-01


    Size :

    201500 byte




    Type of media :

    Conference paper


    Type of material :

    Electronic Resource


    Language :

    English



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