Summary form only given. Modules which implement high-density parallel free-space board-to-board optical interconnections have been constructed with linear arrays of components. These free-space optical interconnections provide the capability for dense z-axis interconnections perpendicular to boards or multichip modules. Each parallel interconnection contains an edge-emitting InGaAs laser array, transmitter and receiver lens arrays, and an InGaAs detector array flip-chip attached to a GaAs heterojunction bipolar transistor amplifier array.


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    Title :

    High-speed high-density parallel free-space optical interconnections


    Contributors:
    Tsang, D.Z. (author) / Roussell, H.V. (author) / Woodhouse, J.D. (author) / Donnelly, J.P. (author) / Wang, C.A. (author) / Spears, D.L. (author) / Bailey, R.J. (author) / Mull, D.E. (author) / Pedrotti, K.D. (author) / Seabury, C.W. (author)

    Published in:

    Proceedings of LEOS'94 ; 1 ; 217-218 vol.1


    Publication date :

    1994-01-01


    Size :

    181850 byte




    Type of media :

    Conference paper


    Type of material :

    Electronic Resource


    Language :

    English



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