Summary form only given. Modules which implement high-density parallel free-space board-to-board optical interconnections have been constructed with linear arrays of components. These free-space optical interconnections provide the capability for dense z-axis interconnections perpendicular to boards or multichip modules. Each parallel interconnection contains an edge-emitting InGaAs laser array, transmitter and receiver lens arrays, and an InGaAs detector array flip-chip attached to a GaAs heterojunction bipolar transistor amplifier array.
High-speed high-density parallel free-space optical interconnections
Proceedings of LEOS'94 ; 1 ; 217-218 vol.1
01.01.1994
181850 byte
Aufsatz (Konferenz)
Elektronische Ressource
Englisch
High-Speed High-Density Parallel Free-Space Optical Interconnections
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