In hybrid IR FPAs, infrared photodetectors and Si read out integrated circuits (ROICs) are bonded together with indium bumps by flip-chip bonding. The heat-force coupling field of the package joints between infrared photodetectors and ROICs is simulated based on finite-element analysis (FEA) software for finding strain position of the bump and optimizing, and reducing fatigue.


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    Title :

    Simulation and optimization of the package joints in the Quantum well infrared photodetectors Focal Plane Array


    Contributors:
    Lin, J. (author) / Guo, F (author) / Li, N (author) / Zhu, Z (author)


    Publication date :

    2006-09-01


    Size :

    1117679 byte




    Type of media :

    Conference paper


    Type of material :

    Electronic Resource


    Language :

    English



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