In hybrid IR FPAs, infrared photodetectors and Si read out integrated circuits (ROICs) are bonded together with indium bumps by flip-chip bonding. The heat-force coupling field of the package joints between infrared photodetectors and ROICs is simulated based on finite-element analysis (FEA) software for finding strain position of the bump and optimizing, and reducing fatigue.
Simulation and optimization of the package joints in the Quantum well infrared photodetectors Focal Plane Array
01.09.2006
1117679 byte
Aufsatz (Konferenz)
Elektronische Ressource
Englisch
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