In hybrid IR FPAs, infrared photodetectors and Si read out integrated circuits (ROICs) are bonded together with indium bumps by flip-chip bonding. The heat-force coupling field of the package joints between infrared photodetectors and ROICs is simulated based on finite-element analysis (FEA) software for finding strain position of the bump and optimizing, and reducing fatigue.


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    Titel :

    Simulation and optimization of the package joints in the Quantum well infrared photodetectors Focal Plane Array


    Beteiligte:
    Lin, J. (Autor:in) / Guo, F (Autor:in) / Li, N (Autor:in) / Zhu, Z (Autor:in)


    Erscheinungsdatum :

    01.09.2006


    Format / Umfang :

    1117679 byte




    Medientyp :

    Aufsatz (Konferenz)


    Format :

    Elektronische Ressource


    Sprache :

    Englisch



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