In summary, flip-chip provides a mounting scheme with excellent electrical and thermal properties for high-speed laser diodes. In addition, it is compatible with passive alignment to fibres, thus making it attractive for low-cost packaging of transmitter modules.


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    Title :

    Flip-chip bonding of high-speed laser diodes


    Contributors:
    Lindgren, S. (author) / Ahlfeldt, H. (author) / Kerzar, B. (author) / Kjebon, O. (author)


    Publication date :

    1996-01-01


    Size :

    214843 byte




    Type of media :

    Conference paper


    Type of material :

    Electronic Resource


    Language :

    English



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