In summary, flip-chip provides a mounting scheme with excellent electrical and thermal properties for high-speed laser diodes. In addition, it is compatible with passive alignment to fibres, thus making it attractive for low-cost packaging of transmitter modules.


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    Titel :

    Flip-chip bonding of high-speed laser diodes


    Beteiligte:
    Lindgren, S. (Autor:in) / Ahlfeldt, H. (Autor:in) / Kerzar, B. (Autor:in) / Kjebon, O. (Autor:in)


    Erscheinungsdatum :

    01.01.1996


    Format / Umfang :

    214843 byte




    Medientyp :

    Aufsatz (Konferenz)


    Format :

    Elektronische Ressource


    Sprache :

    Englisch



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