In the first part of this talk, we will present our latest results on the integration of VCSELs with Si ICs using substrate removal and some other alternate techniques. The substrate removal technique uses mechanical polishing and wet chemical etching to remove the substrate. In the second part of the talk, we will discuss the integration of VCSELs, GaAs MESFETs, and resonant cavity photodiodes (RC-PDs) on a single epitaxial wafer with planar process and thermal oxidization.


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    Title :

    Time-to-space transformation of femtosecond optical pulses with 12% conversion efficiency using KNbO/sub 3/


    Contributors:
    Kanan, A.M. (author) / Weiner, A.M. (author)


    Publication date :

    1997-01-01


    Size :

    132661 byte





    Type of media :

    Conference paper


    Type of material :

    Electronic Resource


    Language :

    English