In the first part of this talk, we will present our latest results on the integration of VCSELs with Si ICs using substrate removal and some other alternate techniques. The substrate removal technique uses mechanical polishing and wet chemical etching to remove the substrate. In the second part of the talk, we will discuss the integration of VCSELs, GaAs MESFETs, and resonant cavity photodiodes (RC-PDs) on a single epitaxial wafer with planar process and thermal oxidization.
Time-to-space transformation of femtosecond optical pulses with 12% conversion efficiency using KNbO/sub 3/
01.01.1997
132661 byte
Aufsatz (Konferenz)
Elektronische Ressource
Englisch
British Library Conference Proceedings | 1997
|British Library Conference Proceedings | 1997
|