With the fast expansion of Internet usage, the demand of 10 Gb/s transmission optoelectronic devices for local-area-network (LAN) and storage-area-network (SAN) is increasing. The key issues of these applications are to improve the cost, manufacturability, and reliability of optoelectronic devices in high speed access transmission. The authors demonstrate a low cost, highly manufacturable and thermally stable mini-flat transmitter and TO-Can optical sub-assembly for 10 Gb/s Ethernet applications.


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    Title :

    High speed packaging technologies for 10 gigabit Ethernet applications


    Contributors:
    Yung-Sheng Liu, (author) / Mu-Tao Chu, (author) / Yen Chu, (author) / Shin-Ge Lee, (author)


    Publication date :

    2004-01-01


    Size :

    146915 byte




    Type of media :

    Conference paper


    Type of material :

    Electronic Resource


    Language :

    English



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