With the fast expansion of Internet usage, the demand of 10 Gb/s transmission optoelectronic devices for local-area-network (LAN) and storage-area-network (SAN) is increasing. The key issues of these applications are to improve the cost, manufacturability, and reliability of optoelectronic devices in high speed access transmission. The authors demonstrate a low cost, highly manufacturable and thermally stable mini-flat transmitter and TO-Can optical sub-assembly for 10 Gb/s Ethernet applications.
High speed packaging technologies for 10 gigabit Ethernet applications
2004-01-01
146915 byte
Conference paper
Electronic Resource
English
High Speed Packaging Technologies for 10 Gigabit Ethernet Applications
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