With the fast expansion of Internet usage, the demand of 10 Gb/s transmission optoelectronic devices for local-area-network (LAN) and storage-area-network (SAN) is increasing. The key issues of these applications are to improve the cost, manufacturability, and reliability of optoelectronic devices in high speed access transmission. The authors demonstrate a low cost, highly manufacturable and thermally stable mini-flat transmitter and TO-Can optical sub-assembly for 10 Gb/s Ethernet applications.


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    Titel :

    High speed packaging technologies for 10 gigabit Ethernet applications


    Beteiligte:
    Yung-Sheng Liu, (Autor:in) / Mu-Tao Chu, (Autor:in) / Yen Chu, (Autor:in) / Shin-Ge Lee, (Autor:in)


    Erscheinungsdatum :

    01.01.2004


    Format / Umfang :

    146915 byte




    Medientyp :

    Aufsatz (Konferenz)


    Format :

    Elektronische Ressource


    Sprache :

    Englisch



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