We have developed and optimized a step-by-step electroless re-metallization process for aluminum that can reduce the cost and complication of substrate preparation for flip-chip microassembly. Our current effort is to utilize the same electroless plating process to coat optical fibers with a solderable nickel/gold layer, to make them suitable for silicon waferboard integration.


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    Title :

    A low-cost electroless plating method for producing flip-chip bondable and wire-bondable circuit pads for smart pixel application


    Contributors:
    Datta, M. (author) / Merritt, S.A. (author) / Stone, D. (author) / Dagenais, M. (author)


    Publication date :

    1998-01-01


    Size :

    367609 byte




    Type of media :

    Conference paper


    Type of material :

    Electronic Resource


    Language :

    English



    A Low-Cost Electroless Plating Method for Producing Flip-Chip Bondable and Wire-Bondable Circuit Pads for Smart Pixel Application

    IEEE; Lasers and Electro-Optics Society | British Library Conference Proceedings | 1998


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