We have developed and optimized a step-by-step electroless re-metallization process for aluminum that can reduce the cost and complication of substrate preparation for flip-chip microassembly. Our current effort is to utilize the same electroless plating process to coat optical fibers with a solderable nickel/gold layer, to make them suitable for silicon waferboard integration.
A low-cost electroless plating method for producing flip-chip bondable and wire-bondable circuit pads for smart pixel application
1998-01-01
367609 byte
Conference paper
Electronic Resource
English
British Library Conference Proceedings | 1998
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