We have developed and optimized a step-by-step electroless re-metallization process for aluminum that can reduce the cost and complication of substrate preparation for flip-chip microassembly. Our current effort is to utilize the same electroless plating process to coat optical fibers with a solderable nickel/gold layer, to make them suitable for silicon waferboard integration.


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    Titel :

    A low-cost electroless plating method for producing flip-chip bondable and wire-bondable circuit pads for smart pixel application


    Beteiligte:
    Datta, M. (Autor:in) / Merritt, S.A. (Autor:in) / Stone, D. (Autor:in) / Dagenais, M. (Autor:in)


    Erscheinungsdatum :

    01.01.1998


    Format / Umfang :

    367609 byte




    Medientyp :

    Aufsatz (Konferenz)


    Format :

    Elektronische Ressource


    Sprache :

    Englisch



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