Outline: Motivation and introduction, requirements in standards and issues, experimental verification, simulation assisted evaluation, lessons learned.


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    Title :

    Printed Circuit Board Quality: Copper Wrap


    Contributors:
    J. Plante (author) / B. Sood (author) / K. Daniluk (author)

    Publication date :

    2016


    Size :

    29 pages


    Type of media :

    Report


    Type of material :

    No indication


    Language :

    English




    Printed Circuit Board Quality: Copper Wrap

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