Outline: Motivation and introduction, requirements in standards and issues, experimental verification, simulation assisted evaluation, lessons learned.


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    Title :

    Printed Circuit Board Quality: Copper Wrap


    Contributors:

    Conference:

    NASA Quality Leadership Forum (QLF) ; 2016 ; Cocoa Beach, FL, United States


    Publication date :

    2016-03-10


    Type of media :

    Miscellaneous


    Type of material :

    No indication


    Language :

    English




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