Microcircuit failure due to differential thermal expansion depends on technique used to mount components to substrate. Effects of differential thermal expansion on ceramic chip capacitors are investigated for various bonding techniques.


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    Title :

    Reliability of hybrid microcircuit bonding


    Contributors:
    Caruso, S. V. (author) / Kinser, D. L. (author) / Graff, S. M. (author) / Allen, R. V. (author)

    Published in:

    Publication date :

    1976-03-01



    Type of media :

    Miscellaneous


    Type of material :

    No indication


    Language :

    English




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