Microcircuit failure due to differential thermal expansion depends on technique used to mount components to substrate. Effects of differential thermal expansion on ceramic chip capacitors are investigated for various bonding techniques.
Reliability of hybrid microcircuit bonding
NASA Tech Briefs ; 1 , 1
1976-03-01
Miscellaneous
No indication
English
Hybrid Microcircuit Design and Procurement Guide
NTIS | 1970
|Low-Cost Alternatives in Hybrid Microcircuit Packaging
NTRS | 1983
|NTRS | 1978
|