Adhesive sealing, nickel plating, and multiwire boards evaluated. Based on study involving fully developed hardware, report considers adhesive packaging instead of seam welding, nickel-plated Kovar (commercial Fe/NI/Co alloy) packages instead of gold plates ones, and multiwire circuit boards instead of multilayer boards as alternatives for reducing cost of hardware without reducing reliability.


    Access

    Access via TIB

    Check availability in my library


    Export, share and cite



    Title :

    Low-Cost Alternatives in Hybrid Microcircuit Packaging


    Contributors:

    Published in:

    Publication date :

    1983-10-01



    Type of media :

    Miscellaneous


    Type of material :

    No indication


    Language :

    English




    Reliability of hybrid microcircuit bonding

    Caruso, S. V. / Kinser, D. L. / Graff, S. M. et al. | NTRS | 1976


    A Novel Approach to Microcircuit Interconnection and Packaging

    Cohen, Norman I. | SAE Technical Papers | 1965



    Hybrid Microcircuit Design and Procurement Guide

    J. W. Thornell / W. A. Fahley / W. L. Alexander | NTIS | 1970


    Microcircuit-cleaning machine

    Robinson, W. W. / Williamson, J. C. | NTRS | 1978