Method is noncontact and nondestructive. Technique detects solder bonds in solar array of other large circuit board, using thermal-imaging camera. Board placed between heat lamp and camera. Poor joints indiated by "cold" spots on the infrared image.


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    Title :

    Detecting Defective Solder Bonds


    Contributors:
    Paulson, R. (author) / Barney, J. (author) / Decker, H. J. (author)

    Published in:

    Publication date :

    1984-04-01



    Type of media :

    Miscellaneous


    Type of material :

    No indication


    Language :

    English




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