Method is noncontact and nondestructive. Technique detects solder bonds in solar array of other large circuit board, using thermal-imaging camera. Board placed between heat lamp and camera. Poor joints indiated by "cold" spots on the infrared image.


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    Titel :

    Detecting Defective Solder Bonds


    Beteiligte:
    Paulson, R. (Autor:in) / Barney, J. (Autor:in) / Decker, H. J. (Autor:in)

    Erschienen in:

    Erscheinungsdatum :

    01.04.1984



    Medientyp :

    Sonstige


    Format :

    Keine Angabe


    Sprache :

    Englisch




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