Packaging technique seals electronic modules as effectively as potting in epoxy, yet permits removal of encapsulant when component change necessary. Technique encloses module in thin, rigid epoxy/fiberglass shell containing lightweight syntactic foam.
Repairable Encapsulated Electronic Modules
NASA Tech Briefs ; 8 , 2
1984-12-01
Miscellaneous
No indication
English
Repairable System Reliability Prediction
SAE Technical Papers | 2004
|Repairable system reliability prediction
Tema Archive | 2004
|