The basic procedure for fabricating ceramic multilayer boards, for use with beam lead, flip chip, or flying lead semi-conductor devices is described.


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    Title :

    Fabrication of Multilayer Ceramic Interconnection Boards


    Additional title:

    Sae Technical Papers


    Contributors:

    Conference:

    National Aeronautical and Space Engineering and Manufacturing Meeting ; 1971



    Publication date :

    1971-02-01




    Type of media :

    Conference paper


    Type of material :

    Print


    Language :

    English





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