This specification covers a filled epoxy resin formulation, supplied as a one-component system, requiring an oven cure for attainment of its properties. This document has been determined to contain basic and stable technology which is not dynamic in nature.


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    Title :

    Potting Compound, Epoxy One Part, Filled, Heat Cure, Low CTE


    Publication date :

    2015-05-13



    Type of media :

    Conference paper


    Type of material :

    Print


    Language :

    English