The thermal design of integrated avionic racks for aircraft installation must be evaluated from a total systems integration vantage point. The thermal design parameters are the drivers that will dictate the maximum allowable module power for reliability and avionic partitioning. Therefore, the objective of the thermal design procedure must be to provide a system configuration with maximum reliability and minimum aircraft penalty and life cycle costs. As part of the Integrated Rack Concept Study in V/STOL Type Aircraft a procedure was developed and applied to module configurations with chip carrier semiconductor devices.The cooling air requirement at the aircraft environmental control system interface was defined as a function of air supply temperature.


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    Title :

    Thermal Design of Integrated Avionic Racks for Aircraft


    Additional title:

    Sae Technical Papers


    Contributors:

    Conference:

    Intersociety Conference on Environmental Systems ; 1982



    Publication date :

    1982-02-01




    Type of media :

    Conference paper


    Type of material :

    Print


    Language :

    English




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