This paper details the development of standardized avionic enclosures for Naval aircraft, with particular emphasis on the package’s thermal design. The packaging system is unique in that it can accommodate modules of two different standardized sizes (ISEM-2A and 1/2 ATR), and modules having three different cooling modes -conduction cooled, flow-through cooled, and heat pipe cooled. The three module cooling modes, together with required package dissipation rates of 125 watts/MCU and pressure drops below 2.8 mm mercury create a great deal of complexity in the optimization of the thermal system. A computerized optimization program was therefore utilized to achieve specific designs, with results reported for various module mixes and heat exchanger designs.


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    Title :

    Thermal Design of Standard Avionic Enclosures


    Additional title:

    Sae Technical Papers


    Contributors:

    Conference:

    Intersociety Conference on Environmental Systems ; 1982



    Publication date :

    1982-02-01




    Type of media :

    Conference paper


    Type of material :

    Print


    Language :

    English




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