The use of improper adhesives has created many serious problems in microelectronic applications. The author discusses the more significant problems and briefly describes a unique family of adhesive preforms specifically designed to eliminate these problems.


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    Title :

    Adhesives for Microelectronics


    Additional title:

    Sae Technical Papers


    Contributors:

    Conference:

    National Aeronautical and Space Engineering and Manufacturing Meeting ; 1971



    Publication date :

    1971-02-01




    Type of media :

    Conference paper


    Type of material :

    Print


    Language :

    English




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