The use of improper adhesives has created many serious problems in microelectronic applications. The author discusses the more significant problems and briefly describes a unique family of adhesive preforms specifically designed to eliminate these problems.
Adhesives for Microelectronics
Sae Technical Papers
National Aeronautical and Space Engineering and Manufacturing Meeting ; 1971
01.02.1971
Aufsatz (Konferenz)
Englisch
NTIS | 1964
|NTIS | 2017
|Keynote: Space Microelectronics
British Library Conference Proceedings | 1999
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