This specification covers a filled, room-temperature-polymerizing epoxy resin formulation, supplied as a two-component system.
POTTING COMPOUND, EPOXY Bisphenol A-Type Filled, Room Temperature Cure, Low Shrinkage
2011-08-09
Conference paper
English
Insulation , Test procedures , Thermoplastics , Molding , Drying , Resins , Suppliers , Documentation , Polymers