This specification covers a filled, room-temperature-polymerizing epoxy resin formulation, supplied as a two-component system.
POTTING COMPOUND, EPOXY Bisphenol A-Type Filled, Room Temperature Cure, Low Shrinkage
09.08.2011
Aufsatz (Konferenz)
Englisch
Insulation , Test procedures , Thermoplastics , Molding , Drying , Resins , Suppliers , Documentation , Polymers