The evolution of automotive electronics packaging is being accelerated by the increased use of electronics in cars, but is constrained by the severe under-hood environment, by product reliability needs, and by cost. The technologies necessary to be competitive continue to evolve. For example, five years ago hybrid chip and wire were regarded as reliable but too costly; now PCB (Printed Circuit Board) and plastic component technology is functional, but too bulky. Future low cost severe environment ECU (Electronic Control Unit) packaging solutions with good heat dissipation are expected with confidence.


    Access

    Access via TIB

    Check availability in my library


    Export, share and cite



    Title :

    Future low cost electronics packaging for automotive applications


    Additional title:

    Zukünftige preiswerte Halbleitergehäuse für die Kraftfahrzeugelektronik


    Contributors:


    Publication date :

    1993


    Size :

    9 Seiten, 1 Bild, 4 Tabellen


    Type of media :

    Conference paper


    Type of material :

    Print


    Language :

    English




    Lead-free solder development for automotive electronics packaging applications

    Shangguan, Dongkai / Achari, A. | Tema Archive | 1995


    Advanced packaging technologies for automotive electronics

    Sham, Man-Lung / Gao, Ziyang / Leung, L.L.W. et al. | Tema Archive | 2007


    Packaging for next generation automotive electronics

    Miller,P. / Nisbet,M. / Ricardo Consulting,GB | Automotive engineering | 2004


    Packaging for Next Generation Automotive Electronics

    Miller, P. / Nisbet, M. / Society of Automotive Engineers | British Library Conference Proceedings | 2004


    Automotive electronics: the future?

    McIntyre, S. / Phail, F. / Thomas, S. | Tema Archive | 1989