The methodology and criteria employed in the selection of a thick film materials system to meet a demanding automotive under-the-hood circuit application are discussed. Conductor, resistor and dielectric performance specifications are provided. A variety of dielectric strategies are characterized in terms of process robustness, functionality, circuit production yield, environmental reliability and component solder-joint integrity. The mechanisms for important materials interactions are also illustrated. Product assurance testing, issues related to high-volume manufacturing and approaches to the cost reduction of the next generation of circuits are discussed.
Multilayer materials system for automotive applications
Mehrschichtmaterialsystem für Kraftfahrzeuganwendungen
1995
6 Seiten, 8 Bilder, 2 Tabellen, 3 Quellen
Conference paper
English
Dickschichttechnik , Dickschichtschaltung , Kraftfahrzeugelektrik , Mehrschichtschaltung , Flip-Chip-Technologie , Bonden , Silberlegierung , Palladiumlegierung , Platinlegierung , Zuverlässigkeit , gedruckte Schaltung , Produktivität , elektrischer Isolierstoff , Bremse , Kostensenkung , Epoxidharz , Feuchteschutz , Silikon (Polymer) , Temperaturwechselbeständigkeit
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