The methodology and criteria employed in the selection of a thick film materials system to meet a demanding automotive under-the-hood circuit application are discussed. Conductor, resistor and dielectric performance specifications are provided. A variety of dielectric strategies are characterized in terms of process robustness, functionality, circuit production yield, environmental reliability and component solder-joint integrity. The mechanisms for important materials interactions are also illustrated. Product assurance testing, issues related to high-volume manufacturing and approaches to the cost reduction of the next generation of circuits are discussed.


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    Title :

    Multilayer materials system for automotive applications


    Additional title:

    Mehrschichtmaterialsystem für Kraftfahrzeuganwendungen


    Contributors:


    Publication date :

    1995


    Size :

    6 Seiten, 8 Bilder, 2 Tabellen, 3 Quellen



    Type of media :

    Conference paper


    Type of material :

    Print


    Language :

    English




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