The methodology and criteria employed in the selection of a thick film materials system to meet a demanding automotive under-the-hood circuit application are discussed. Conductor, resistor and dielectric performance specifications are provided. A variety of dielectric strategies are characterized in terms of process robustness, functionality, circuit production yield, environmental reliability and component solder-joint integrity. The mechanisms for important materials interactions are also illustrated. Product assurance testing, issues related to high-volume manufacturing and approaches to the cost reduction of the next generation of circuits are discussed.


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    Titel :

    Multilayer materials system for automotive applications


    Weitere Titelangaben:

    Mehrschichtmaterialsystem für Kraftfahrzeuganwendungen


    Beteiligte:
    Sarma, D.H.R. (Autor:in) / Richter, F.E. (Autor:in) / McDermott, M.G. (Autor:in) / Needes, C.R.S. (Autor:in) / McCormick, C.J. (Autor:in) / Anderson, D.K. (Autor:in)


    Erscheinungsdatum :

    1995


    Format / Umfang :

    6 Seiten, 8 Bilder, 2 Tabellen, 3 Quellen



    Medientyp :

    Aufsatz (Konferenz)


    Format :

    Print


    Sprache :

    Englisch




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