The author reviews some basic mechanical design approaches available to assure reliable interfaces within and between packaging levels in the chip, package, and circuit-board assemblies. While the approaches can be applied to traditional circuit-board and hybrid assemblies emphasis is placed on the hybrid wafer-scale integration multichip module packaging technologies. It is concluded that a combination of recently available packaging materials of improved properties, recently developed improved analysis techniques, and the advantages of the new hybrid wafer-scale integration technology offers the opportunity to design significantly improved reliability into the next generation of military electronic equipment. Additionally, the equipment size and weight can be reduced significantly. A dramatic demonstration of the miniaturization possible with these technologies was made on a miniaturized version of a GPS (global positioning system) receiver.


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    Title :

    Mechanical considerations for reliable interfaces in next generation electronics packaging


    Additional title:

    Mechanische Betrachtungen fuer zuverlaessige Schnittstellen bei den elektronischen Baugruppen der naechsten Generation


    Contributors:
    Hagge, J.K. (author)


    Publication date :

    1989


    Size :

    6 Seiten, 7 Quellen


    Type of media :

    Conference paper


    Type of material :

    Print


    Language :

    English




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