The author reviews some basic mechanical design approaches available to assure reliable interfaces within and between packaging levels in the chip, package, and circuit-board assemblies. While the approaches can be applied to traditional circuit-board and hybrid assemblies emphasis is placed on the hybrid wafer-scale integration multichip module packaging technologies. It is concluded that a combination of recently available packaging materials of improved properties, recently developed improved analysis techniques, and the advantages of the new hybrid wafer-scale integration technology offers the opportunity to design significantly improved reliability into the next generation of military electronic equipment. Additionally, the equipment size and weight can be reduced significantly. A dramatic demonstration of the miniaturization possible with these technologies was made on a miniaturized version of a GPS (global positioning system) receiver.
Mechanical considerations for reliable interfaces in next generation electronics packaging
Mechanische Betrachtungen fuer zuverlaessige Schnittstellen bei den elektronischen Baugruppen der naechsten Generation
1989
6 Seiten, 7 Quellen
Conference paper
English
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